Viability of anisotropic conductive film (ACF) as a flip chip interconnection technology

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 1122-1132

  Kim, K M ^a   Kim, J O ^a   Kim, S G ^a   Lee, K H ^a   Chen, A S ^a   Ahmad, N ^a   Dugbartey, N ^a   Karnezos, M ^a   Tam, S ^a   Kweon, Y D ^a   Pendse, R ^a  

^a ChipPAC Korea Co   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPY; CONDUCTIVE FILMS; FLIP CHIP DEVICES; RELIABILITY; SUBSTRATES;

ANISOTROPIC CONDUCTIVE FILM; FLIP CHIP INTERCONNECTION TECHNOLOGY; PLASTIC BALL GRID ARRAY; THERMO COMPRESSION ATTACHMENT;

ELECTRONICS PACKAGING;

EID: 0034478425     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)