Aluminium passivation for TMAH based anisotropic etching for MEMS applications

Electronics Letters

Volumn 35, Issue 15, 1999, Pages 1266-1267

  Lian, K ^a   Stark, B ^b   Gundlach, A M ^a   Walton, A J ^a  

^a UNIVERSITY OF EDINBURGH   (United Kingdom)

^b SensoNor   (Norway)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPY; ETCHING; MICROELECTROMECHANICAL DEVICES; PASSIVATION; SEMICONDUCTING ALUMINUM COMPOUNDS; SEMICONDUCTING GLASS; SURFACE ROUGHNESS;

AMMONIUM PERSULFATE; ANISOTROPIC ETCHING; TETRAMETHYL AMMONIUM HYDROXIDE;

SEMICONDUCTING SILICON COMPOUNDS;

EID: 0032680421     PISSN: 00135194     EISSN: None     Source Type: Journal    
DOI: 10.1049/el:19990744     Document Type: Article

References (7)

1. TABATA, O.: 'pH-controlled TMAH etchants for silicon micromachining', Sens. Actuators A, 1996, 53, pp. 335-339
2. PANDY, A., LANDSBERGER, L.M., NIKPOUR, B., PARANJAPE, M., and KAHRIZI, M.: 'Experimental investigation of high Si/Al selectivity during anisotropic etching in tetra-methyl ammonium hydroxide', J. Vac. Sci. Technol., 1998, 16, (2), pp. 868-872
3. SCHNAKENBERG, U., BENECKE, W., and LANGE, P.: 'TMAHW etchants for silicon micromachining'. Tech. Dig. 6th Int. Conf. Solid State Sensors and Actuators, 1991, pp. 815-818
4. SARRO, P.M., BRIDA, S., and VLIST, W.: 'Aluminium passivation in saturated TMAHW solutions for IC-compatible microstructures and device isolation'. Proc. SPIE - Int. Soc. for Optical Engineering, 1996, Vol. 2879, pp. 242-250
5. KLAASSEN, E.H., REAY, R.J., STORMENT, C., and KOVACS, G.T.A.: 'Micromachined thermally isolated circuits', Sens. Actuators A, 1997, 58, pp. 43-50
6. TEA, N.H., MILANOVIC, V., ZINCKE, C.A., SUEHLE, J.S., GAITAN, M., ZAGHLOUL, M.E., and GEIST, J.: 'Hybrid postprocessing etching for CMOS-compatible MEMS', J. Microelectromech. Syst., 1997, 6, (4), pp. 363-372
7. ZIELKE, D., and FRUHAUF, J.: 'Determination of rates for orientation-dependent etching', Sens. Actuators A, 1995, 48, pp. 151-156