The effects of in-plane orthotropic properties in a multi-chip ball grid array assembly

Microelectronics Reliability

Volumn 42, Issue 6, 2002, Pages 943-949

  Moore, Thomas D ^a   Jarvis, John L ^b  

^a ANALOG DEVICES   (Ireland)

^b UNIVERSITY OF LIMERICK   (Ireland)

Author keywords

[No Author keywords available]

Indexed keywords

ELASTIC MODULI; FINITE ELEMENT METHOD; LAMINATES; MECHANICAL TESTING; PRINTED CIRCUIT BOARDS; SUBSTRATES; THERMAL EXPANSION;

BALL GRID ARRAY (BGA) ASSEMBLY;

MULTICHIP MODULES;

EID: 0036603892     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(02)00010-0     Document Type: Article

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