Influence of material combination on warpage and reflow crack resistance of PBGA

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 1998, Pages 296-301

  Kousaka, T ^a   Suzuki, N ^a   Yasuda, M ^a  

^a Showa Denko Materials Co   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK PROPAGATION; INTEGRATED CIRCUIT MANUFACTURE; POLYMERIZATION; SHRINKAGE;

PLASTIC BALL GRID ARRAYS (PBGA); REFLOW CRACK RESISTANCE;

ELECTRONICS PACKAGING;

EID: 0032230635     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (3)