Determination of BGA structural defects and solder joint defects by 3D X-ray laminography

Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA

Volumn , Issue , 2001, Pages 146-150

  Moore, T D ^a   Vanderstraeten, D ^a   Forssell, P ^a  

^a ANALOG DEVICES   (Ireland)

Author keywords

[No Author keywords available]

Indexed keywords

DEFECTS; FAILURE ANALYSIS; INTEGRATED CIRCUIT LAYOUT; PRINTED CIRCUIT BOARDS; SEMICONDUCTOR DEVICE STRUCTURES; SOLDERED JOINTS; SUBSTRATES; THREE DIMENSIONAL; X RAY RADIOGRAPHY;

SOLDER JOINT DEFECTS; X RAY LAMINOGRAPHY;

ELECTRONICS PACKAGING;

EID: 0034832734     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

1. Detection of underfill epoxy defects in flip chip packages with the aid of SAM, parallel polishing & FIB
2. Failure analysis and stress simulation in small multichip BGAs
3. Digital computed laminography and tomosynthesis - Functional principles and industrial applications
4. Development of an inspection process for ball-grid-array technology using scanned-beam x-ray laminography
5. Three-dimensional visualization of multilayered assemblies using x-ray laminography
6. Improvements of x-ray laminography for automated inspection of solder joints
7. A new method for image separation of overlapped images from a two-layered printed circuit board (PCB)
8. X-ray computed laminography: An approach of computed tomography for applications with limited access
9. A new approach to translational laminographic method for PCB inspection
10. A projection method for reconstructing x-rays of arbitrary cross-section
11. X-ray digital microlaminography for BGA and flip-chip inspection