Role of out-of-plane coefficient of thermal expansion in electronic packaging modeling

Journal of Electronic Packaging, Transactions of the ASME

Volumn 122, Issue 2, 2000, Pages 121-127

  Variyam, Manjula N ^a   Xie, Weidong ^a   Sitaraman, Suresh K ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0043282902     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.483143     Document Type: Article

References (16)

1. Suhir, E., 1986, “Stresses in Bi-Metal Thermostats” ASME J. Appl. Mech., 53, pp. 657-660.
2. Yi-Hsin, Pao, and Eisele, Ellen, 1991, “Interfacial Shear and Peel Stresses in Multi-Layered Thin Stacks subjected to Uniform Thermal Loading,” ASME J. Electron. Packag., 113, pp. 164-172.
3. Yin, W. L., 1993, “Thermal Stresses in Anisotropic Multilayered Structures,” Thermal Stress and Strain in Microelectronics Packaging, J. H. Lau, ed., Van Nostrand Reinhold, New York, pp. 95-137.
4. Pan, T. Y., and Pao, Y. H., 1990, “Deformation in Mutlilayer Stacked Assemblies,” ASME J. Appl. Mech., 112, pp. 30-34.
5. Matthys, L., and De May, G., 1996, “An Analysis of an Engineering Model for the Thermal Mismatch Stresses at the Interface of a Uniformly Heated Two Layer Structure,” Int. J. Microelectron. Packag., 19, No. 3, pp. 323-329.
6. Hu, Shoufeng, and Pagano, N. J., 1997, “On the use of a Plane-Strain Model to Solve Generalized Plane-Strain Problems,” ASME J. Appl. Mech., 64, pp. 236-238.
7. Pagano, N. J., 1989, Interlaminar Response of Composite Materials, Elsevier Science Publishers B.V., Amsterdam.
8. Robbins, D. H., and Reddy, J. N., 1996, “Variable Kinematic Modelling of Laminated Composite Plates,” Int. J. Numer. Methods Eng., 39, pp. 2283-2317.
9. Chandrashekhara, S., and Santhosh, N., 1987, “Free Edge Stress Analysis of Laminates by a Mixed Method of Elasticity,” Proceedings of the American Society for Composites, pp. 479-488.
10. Bhat, N. V., and Lagace, P. A., 1994, “An Analytical Method for Evaluation of Interlaminal Stresses Due to Material Discontinuities,” J. Comp. Mat., 28, No. 3, pp. 190-210.
11. Tsai, M. Y., and Morton, J., 1994, “A Note on Peel Stresses in Single-Lap Adhesive Joints,” ASME J. Appl. Mech., 61, pp. 712-715.
12. Burgreen, David, 1971, Elements of Thermal Stress Analysis, C. P. Press, Jamaica, New York.
13. Xie, Weidong, and Sitaraman, Suresh K., 1999, “Analysis of Interlaminar Thermal Stresses in Unsymmetric Multi-Layered electronic Assemblies and Packages,” EEP-Vol. 26-2, Advances in Electronic Packaging-1999, Vol. 2, ASME, pp. 1155-1163.
14. Suhir, E., 1986, “Calculated Thermally Induced Stresses in Adhesively Bonded and Soldered Assemblies,” Proceedings of the 1986 International Symposium on Microelectronics, Atlanta, GA, ISHM, pp. 383-392.
15. Mirman, Ilya B., 1991, “Effects of Peeling Stresses in Bimaterial Assembly,” ASME J. Electron. Packag., 113, pp. 431-433.
16. Kassapoglou, C., and Lagace, P. A., 1986, “An Efficient Method for the Calculation of Interlaminar Stresses in Composite Materials,” ASME J. Appl. Mech., 53, pp. 744-750.