Improved reliability in small multichip ball grid arrays

Microelectronics Reliability

Volumn 41, Issue 3, 2001, Pages 461-469

  Moore, Thomas D ^a   Jarvis, John L ^b  

^a Analog D ^*  (Ireland)

^b UNIVERSITY OF LIMERICK   (Ireland)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK PROPAGATION; ELECTRONICS PACKAGING; FAILURE ANALYSIS; FINITE ELEMENT METHOD; INTEGRATED CIRCUIT MANUFACTURE; MULTICHIP MODULES; PHOTORESISTS; STRESS ANALYSIS; SUBSTRATES;

BALL GRID ARRAYS (BGA); THERMAL SHOCKS; THERMOMECHANICAL STRESS;

MICROELECTRONICS;

EID: 0035277040     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(00)00230-4     Document Type: Article

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