Closed form vs. finite element analysis of laminated stacks

Finite elements in analysis and design

Volumn 32, Issue 3, 1999, Pages 163-179

  Basaran, Cemal ^a   Zhao, Ying ^a  

^a UNIVERSITY AT BUFFALO   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELASTICITY; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; SENSITIVITY ANALYSIS; STRESS ANALYSIS; STRUCTURAL ANALYSIS; THERMODYNAMICS; VISCOPLASTICITY;

LAMINATED STACKS;

LAMINATES;

EID: 0032626553     PISSN: 0168874X     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0168-874X(99)00012-8     Document Type: Article

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