Formation of Ni3Sn4 at the boundary between Sn-Pb soldering layers and Au/Ni plated coatings

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn , Issue , 2000, Pages 135-140

  Maeda, Akira ^a   Umemura, Toshio ^a   Wu, Qiang ^a   Tomita, Yoshihiro ^a   Abe, Takeshi ^a  

^a MITSUBISHI ELECTRIC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROLESS PLATING; ELECTRONICS PACKAGING; GOLD ALLOYS; INTERMETALLICS; NICKEL ALLOYS; PHOSPHORUS; PRINTED CIRCUIT BOARDS; SOLDERED JOINTS; SOLDERING ALLOYS; TIN ALLOYS;

UNDER BUMP METALLIZATION;

PRINTED CIRCUIT MANUFACTURE;

EID: 0033685416     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)