Influence of nickel/gold surface finish on the assembly quality and long term reliability of thermally enhanced BGA packages

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1999, Pages 23-35

  Coyle, R J ^a   Holliday, A ^a   Mescher, P ^a   Solan, P P ^a   Gahr, S A ^a   Cyker, H A ^a   Dorey, K ^a   Ejim, T I ^a  

^a NOKIA RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BRITTLE FRACTURE; ELECTROLESS PLATING; FINISHING; GOLD PLATING; INTERFACES (MATERIALS); NICKEL PLATING; PRINTED CIRCUIT MANUFACTURE; SHEAR STRESS; THERMAL EFFECTS;

BALL GRID ARRAYS (BGA); CHIP SCALE PACKAGES (CSP); INTERFACIAL FAILURES;

ELECTRONICS PACKAGING;

EID: 0033340777     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (29)