Impact of on-die discrete heating on thermal performance characteristics of silicon based IC electronic packages

American Society of Mechanical Engineers, Design Engineering Division (Publication) DE

Volumn 104, Issue , 1999, Pages 99-106

  Adams, V H ^a   Ramakrishna, K ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; EMBEDDED SYSTEMS; HEAT TRANSFER; INTEGRATED CIRCUITS; MATHEMATICAL MODELS; SEMICONDUCTING SILICON; THERMAL CONDUCTIVITY;

DISCRETE HEATING; HEAT GENERATION; JUNCTION TO AMBIENT TEMPERATURE DIFFERENCE; SILICON BASED INTEGRATED CIRCUIT COMPONENTS;

ELECTRONICS PACKAGING;

EID: 0033295470     PISSN: None     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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