메뉴 건너뛰기




Volumn 19, Issue 2, 1997, Pages 2123-2130

Performance characterization of thermal vias

Author keywords

[No Author keywords available]

Indexed keywords


EID: 0012040150     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article
Times cited : (4)

References (18)
  • 4
    • 5844409026 scopus 로고
    • Thermal Management of Multi-Chip Modules
    • June
    • T. Dolbear, "Thermal Management of Multi-Chip Modules", Electronic Packaging and Production, pp. 60-63, June 1992.
    • (1992) Electronic Packaging and Production , pp. 60-63
    • Dolbear, T.1
  • 7
    • 5844326306 scopus 로고
    • Correlation of Modeled Thermal Resistance and Experimental Measurements for Aluminum Nitride and Alumina Thin-Film Ceramic Multichip Modules
    • C. Ryan, A. Keeley, "Correlation of Modeled Thermal Resistance and Experimental Measurements for Aluminum Nitride and Alumina Thin-Film Ceramic Multichip Modules", Proceedings of the 1991 International Electronic Packaging Conference", pp. 447-56, 1991.
    • (1991) Proceedings of the 1991 International Electronic Packaging Conference , pp. 447-456
    • Ryan, C.1    Keeley, A.2
  • 11
    • 5844382520 scopus 로고
    • High Density Interconnect Substrate for High Power Dissipation GaAs LSIs
    • A. Miki, M. Nishiguachi, H. Nishizawa, "High Density Interconnect Substrate for High Power Dissipation GaAs LSIs", Sumitomo electric Technical Review, no. 36, pp. 55-60, 1993.
    • (1993) Sumitomo Electric Technical Review , Issue.36 , pp. 55-60
    • Miki, A.1    Nishiguachi, M.2    Nishizawa, H.3
  • 12
    • 5844330552 scopus 로고
    • Achieving a Balance of Thermal Performance and Routing Density in a Multichip Module
    • A. Keeley, C. Ryan, "Achieving a Balance of Thermal Performance and Routing Density in a Multichip Module", NEPCON East '91, pp. 551-61, 1991.
    • (1991) NEPCON East '91 , pp. 551-561
    • Keeley, A.1    Ryan, C.2
  • 13
    • 17144468764 scopus 로고
    • Advances in Through-Substrate Cooling of High Power IC Packages
    • G. Stefani, "Advances in Through-Substrate Cooling of High Power IC Packages", Advances in Electronic Packaging, Vol 4-2, pp. 723-734, 1993.
    • (1993) Advances in Electronic Packaging , vol.4 , Issue.2 , pp. 723-734
    • Stefani, G.1
  • 15
    • 0028497879 scopus 로고
    • Heat Conduction in Concentric Cylinders: An Application to Electronic Packages
    • S. Sathe, "Heat Conduction in Concentric Cylinders: An Application to Electronic Packages", Journal of Electronic Packaging, vol. 116, no. 3, pp. 230-3, 1994.
    • (1994) Journal of Electronic Packaging , vol.116 , Issue.3 , pp. 230-233
    • Sathe, S.1
  • 17
    • 5844406756 scopus 로고    scopus 로고
    • NASA Reference Publication 1121, 1984
    • NASA Reference Publication 1121, 1984.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.