Thermal assessment and enhancement of molded array (MAP) PBGA packages for handheld telecommunication applications

American Society of Mechanical Engineers, Manufacturing Engineering Division, MED

Volumn 11, Issue , 2000, Pages 433-442

  Adams, V H ^a   Chiriac, V A ^b   Lee, T Y Tom ^b  

^a Digital DNA Laboratories   (United States)

^b Semiconduct Prod Sector M   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0039335317     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (18)

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10. Zahn, B., "Optimizing Cost and Thermal Performance: Rapid Prototyping of a High Pin Count Cavity-Up Enhanced Plastic Ball Grid Array (EPBGA) Package," Proc. Fifteenth SEMI-THERM Symp., pp. 133-140, 1999.
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15. th edition, Harper & Row Publishers, New York, NY, 1986.
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