Low-cost MOEM interconnect modules for Tb/s.cm2 aggregate bandwidth to Silicon chips

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4408, Issue , 2001, Pages 6-18

  Thienpont, H ^a   Baukens, V ^a   Volckaerts, B ^a   Ottevaere, H ^a   Debaes, C ^a   Vervaeke, M ^a   Tuteleers, P ^a   Vynck, P ^a   Hermanne, A ^a   Hanney, M ^a   Brunfaut, M ^a   Van Campenhout, J M ^a   Veretennicoff, I ^a  

^a VRIJE UNIVERSITEIT BRUSSEL   (Belgium)

Author keywords

Deep lithography with protons; Micro opto mechanical systems; Optical interconnects; Plastics; VCSELs

Indexed keywords

BANDWIDTH; BIT ERROR RATE; CMOS INTEGRATED CIRCUITS; COMPUTER SOFTWARE; FIBER OPTICS; MICROOPTICS; OPTICAL INTERCONNECTS; PHOTOLITHOGRAPHY; POLYMETHYL METHACRYLATES; RAPID PROTOTYPING; RAY TRACING; SEMICONDUCTOR LASERS; SENSITIVITY ANALYSIS; SILICON WAFERS;

MICRO-OPTOELECTROMECHANICAL SYSTEMS (MOEMS);

MICROELECTROMECHANICAL DEVICES;

EID: 17944376995     PISSN: 0277786X     EISSN: None     Source Type: Journal    
DOI: 10.1117/12.425348     Document Type: Article

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