Chip level three-dimensional assembling of microsystems

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3680, Issue II, 1999, Pages 679-686

  Toshiyoshi, Hiroshi ^a   Mita, Yoshio ^a   Ogawa, Minoru ^a   Fujita, Hiroyuki ^a  

^a UNIVERSITY OF TOKYO   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROPLATING; FLIP CHIP DEVICES; MICROELECTROMECHANICAL DEVICES; PLASMA ETCHING; REACTIVE ION ETCHING; SILICON WAFERS;

CHIP LEVEL THREE-DIMENSIONAL ASSEMBLING; INDUCTIVELY COUPLED PLASMA-REACTIVE ION ETCHING (ICP-RIE); MICROSYSTEMS;

INTEGRATED OPTOELECTRONICS;

EID: 0032637736     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.341260     Document Type: Conference Paper

References (7)