Optimal oxidation control for enhancement of copper lead frame-EMC adhesion in packaging process

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 1148-1153

  Moon, Byung Hoon ^a   Yoo, Hee Yeoul ^a   Sawada, K ^b  

^a Anam Industrial Co   (South Korea)

^b TOSHIBA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROMAGNETIC COMPATIBILITY; NETWORK COMPONENTS; OXIDATION; ADHESION; BOND STRENGTH (MATERIALS); COPPER; EPOXY RESINS; PROCESS CONTROL;

COPPER LEAD FRAMES; EPOXY MOLDING COMPOUNDS; LEAD FRAME; LOWER LIMITS; OXIDE LAYER THICKNESS; PACKAGING PROCESS; UPPER LIMITS;

PROCESS CONTROL; ELECTRONICS PACKAGING;

COPPER LEAD FRAMES; EPOXY MOLDING COMPOUNDS;

EID: 0031624416     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678861     Document Type: Conference Paper

References (8)

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