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Volumn , Issue , 1997, Pages 188-193
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RBS measurement of the thickness of nanometer oxide layers: Adhesion strength between copper leadframe and molding compound correlated with the oxide layer thickness
a
a
SIEMENS AG
(Germany)
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Author keywords
[No Author keywords available]
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Indexed keywords
ADHESION;
BOND STRENGTH (MATERIALS);
COPPER COMPOUNDS;
CURING;
OXIDATION;
OXIDES;
RUTHERFORD BACKSCATTERING SPECTROSCOPY;
SHEET MOLDING COMPOUNDS;
THICKNESS MEASUREMENT;
COPPER LEADFRAME;
ELECTRONICS PACKAGING;
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EID: 0031329296
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (9)
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References (14)
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