Shear test for adhesion measurement of small structures

International Integrated Reliability Workshop Final Report

Volumn , Issue , 1996, Pages 31-36

  Schammler, G ^a   Buschick, K ^a   Hahn, R ^a   Reichl, H ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; FRACTURE; MULTICHIP MODULES; OXIDES; POLYIMIDES; SHEAR STRENGTH; SPUTTER DEPOSITION; SUBSTRATES; THERMAL CYCLING;

ADHESION MEASUREMENT; SHEAR TESTING;

SEMICONDUCTOR DEVICE STRUCTURES;

EID: 0030349984     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)