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Volumn , Issue , 1999, Pages 714-720
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Oxide adhesion characteristic of lead frame copper alloys
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Author keywords
[No Author keywords available]
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Indexed keywords
ADHESION;
CRACKS;
DELAMINATION;
ELECTRONICS PACKAGING;
MECHANICAL PROPERTIES;
METALLIC FILMS;
OXIDATION;
OXIDES;
PEELING;
SHEAR STRENGTH;
SOLDERING;
THERMAL EFFECTS;
ANTITARNISH COATING;
FLASH COPPER PLATING;
LEAD FRAME COPPER ALLOYS;
OXIDE FILM THICKNESS;
PLASTIC PACKAGE;
REFLOW SOLDERING;
COPPER ALLOYS;
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EID: 0032630749
PISSN: 05695503
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Article |
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Times cited : (25)
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References (14)
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