Effect of oxidation on mold compound-copper leadframe adhesion

Proceedings - International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces

Volumn , Issue , 1999, Pages 77-82

  Berriche, R ^a   Vahey, S C ^a   Gillett, B A ^a  

^a INTERSIL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; BOND STRENGTH (MATERIALS); COPPER; COPPER ALLOYS; INTERFACES (MATERIALS); MOLDS; OXIDATION; TESTING;

BUTTON SHEAR TESTS; COHESIVE STRENGTH; COPPER OXIDE LAYERS; CU ADHESIONS; LEAD-FRAME; MOLD COMPOUNDS; OXIDATION TEMPERATURE;

PACKAGING MATERIALS;

EID: 79951655812     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.1999.757291     Document Type: Conference Paper

References (9)

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