IC fabrication-compatible processing for instrumentation and measurement applications

IEEE Transactions on Instrumentation and Measurement

Volumn 50, Issue 6, 2001, Pages 1475-1484

  Wijngaards, Davey D L ^a,b   Wolffenbuttel, Reinoud F ^a,b  

^a IEEE   (Netherlands)

^b DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

Fabrication compatibility; Metrology; Microsystem machining; On chip cointegration

Indexed keywords

HYBRID TECHNOLOGY; MICROMACHINED DEVICES; ON CHIP COINTEGRATION; SOLID STATE SENSOR;

MEASUREMENTS; MECHANICAL PROPERTIES; MICROELECTROMECHANICAL DEVICES; PHOTOLITHOGRAPHY; SILICON SENSORS; SOLID STATE DEVICES;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0035722370     PISSN: 00189456     EISSN: None     Source Type: Journal    
DOI: 10.1109/19.982931     Document Type: Article

References (32)

1. Integrated silicon automotive accelerometer
2. Silicon fusion bonding for fabrication of sensors, actuators and microstructures
3. An integrated force-balance capacitive accelerometer for low-g application
4. Quo vadis silicon sensors
5. A discussion on yield modeling with defect clustering, circuit repair and circuit redundancy
6. Pressure, flow, and oxygen saturation sensors on one chip for use in catheters
7. Sensor technology strategy in silicon
8. Evaluation of the fabrication of pressure sensors using bulk micromachining before IC processing
9. Photodiodes in silicon with an electrically-programmable UV response
10. Micropower CMOS temperature sensor with digital output
11. Theoretical and experimental study of the piezojunction effect in bipolar transistors at moderate stress levels
12. CMOS as a sensor technology
13. CMOS foundry-based micromachining
14. Surface micromachining by sacrificial aluminum etching
15. Bipolar compatible epitaxial polysilicon for smart sensors-stress minimization and applications
16. Sealing RIE etch holes for an epi-micromachined pressure sensor
17. Laminated high aspect ratio microstructures in a conventional CMOS process
18. Stiction in surface micromachining
19. Etching problems in the presence of aluminum interconnect
20. A fully integrated micromachined pressure sensor with low temperature dependence
21. Silicon IC process compatible thin metal film post-processing module
22. Analysis of a CMOS low-power thermoelectric generator
23. Design and fabrication of on-chip integrated poly SiGe and poly Si Peltier devices
24. Nanotechnology for next-generation Josephson voltage standards
25. Development of thin-film multijunction thermal converters at PTB/IPHT
26. Diode-based thermal RMS converter with on-chip circuitry fabricated using CMOS technology
27. A microcontroller-based driver to stabilize the temperature of an optical stage to within 1 mK in the range 4-38°C, using a Peltier heat pump and a thermistor sensor
28. Modeling of a microelectromechanical thermoelectric cooler
29. High-temperature accurate thermal sensing using integrated platinum resistors on silicon
30. Formation of high adhesive and pure Pt layers on TiO
31. The industrial production of high-quality nickel-chromium resistors with controlled temperature coefficient of resistance