Microscopic investigation of electromigration failure in narrow Cu interconnects

Advanced Metallization Conference (AMC)

Volumn , Issue , 2001, Pages 497-502

  Michael, Nancy L ^a   Kim, Choong Un ^a   Jiang, Qing Tang ^a   Augur, Rod ^a  

^a UNIVERSITY OF TEXAS AT ARLINGTON   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; DIFFUSION; ELECTRIC RESISTANCE; INTERCONNECTION NETWORKS; INTERFACES (MATERIALS); INTERFACIAL ENERGY; KINETIC THEORY; MORPHOLOGY; PASSIVATION; SCANNING ELECTRON MICROSCOPY; SILICON NITRIDE; TRANSMISSION ELECTRON MICROSCOPY;

DAMASCENE STRUCTURES;

ELECTROMIGRATION;

EID: 0035554818     PISSN: 10480854     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (16)