Stress and piezoelectric properties of aluminum nitride thin films deposited onto metal electrodes by pulsed direct current reactive sputtering

Journal of Applied Physics

Volumn 89, Issue 11 I, 2001, Pages 6389-6395

  Dubois, Marc Alexandre ^a   Muralt, Paul ^a  

^a EPFL   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0035356644     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1359162     Document Type: Article

References (24)

1. K. Tsubouchi and N. Mikoshiba, IEEE Trans. Sonics Ultrason. SU-32, 634 (1985).
2. L. B. Rowland, R. S. Kern, S. Tanaka, and R. F. Davis, J. Mater. Res. 8, 2310 (1993).
3. H. Okano, N. Tanaka, M. Kobayashi, T. Usuki, and K. Shibata, Jpn. J. Appl. Phys., Part 1 34, 5172 (1995).
4. R. D. Vispute, H. Wu, and J. Narayan, Appl. Phys. Lett. 67, 1549 (1995).
5. H. Okano, Y. Takahashi, T. Tanaka, K. Shibata, and S. Nakano, Jpn. J. Appl. Phys., Part 1 31, 3446 (1992).
6. A. Rodríguez-Navarro, W. Otaño-Rivera, J. M. García-Ruiz, and R. Messier, J. Mater. Res. 12, 1850 (1997).
7. G. L. Huffman, D. E. Fahnline, R. Messier, and L. J. Pilione, J. Vac. Sci. Technol. A 7, 2252 (1989).
8. W. J. Meng, J. A. Sell, T. A. Perry, and G. L. Eesley, J. Vac. Sci. Technol. A 11, 1377 (1993).
9. W. J. Meng, J. A. Sell, G. L. Eesley, and T. A. Perry, J. Appl. Phys. 74, 2411 (1993).
10. K. Kusaka, T. Hanabusa, and K. Tominaga, Thin Solid Films 281,282, 340 (1996).
11. H. P. Löbl, M. Klee, O. Wunnicke, R. Kiewitt, R. Dekker, and E. V. Pelt, IEEE Ultrasonics Symposium, Lake Tahoe, NV, 1999, pp. 1031-1036.
12. K. M. Lakin, in Ref. 11, pp. 895-906.
13. R. S. Naik, J. J. Lutsky, R. Reif, C. G. Sodini, A. Becker, L. Fetter, H. Huggins, R. Miller, J. Pastalan, G. Rittenhouse, and Y.-H. Wong, IEEE Trans. Ultrason. Ferroelectr. Freq. Control 47, 292 (2000).
14. A. L. Kholkin, C. Wüthrich, D. V. Taylor, and N. Setter, Rev. Sci. Instrum. 67, 1935 (1996).
15. M.-A. Dubois, P. Muralt, H. Matsumoto, and V. P. Plessky, IEEE Ultrasonics Symposium, Sendai, Japan, 1998, pp. 909-912.
16. M.-A. Dubois and P. Muralt, Appl. Phys. Lett. 74, 3032 (1999).
17. M.-A. Dubois, P. Muralt, and L. Sagalowicz, Ferroelectrics 224, 243 (1998).
18. R. Messier, A. P. Giri, and R. A. Roy, J. Vac. Sci. Technol. A 2, 500 (1984).
19. H.-C. Lee and J.-Y. Lee, J. Mater. Sci.: Mater. Electron. 8, 385 (1997).
20. J. A. Ruffner, P. G. Clem, B. A. Tuttle, D. Dimos, and D. M. Gonzales, Thin Solid Films 354, 256 (1999).
21. F. Bernardini, V. Fiorentini, and D. Vanderbilt, Phys. Rev. B 56, 10024 (1997).
22. L. Zheng, S. Ramalingam, T. Shi, and R. L. Peterson, J. Vac. Sci. Technol. A 11, 2437 (1993).
23. B. Matthes, E. Broszeit, O. Zucker, and P. Gauer, Thin Solid Films 226, 178 (1993).
24. I. L. Guy, S. Muensit, and E. M. Goldys, Appl. Phys. Lett. 75, 4133 (1999).