Effect of nitrogen gas pressure on residual stress in AlN films deposited by the planar magnetron sputtering system

Thin Solid Films

Volumn 281-282, Issue 1-2, 1996, Pages 340-343

  Kusaka, Kazuya ^a   Hanabusa, Takao ^a   Tominaga, Kikuo ^a  

^a UNIVERSITY OF TOKUSHIMA   (Japan)

Author keywords

Aluminium nitride; Sputtering; Stress; X ray diffraction

Indexed keywords

ALUMINUM COMPOUNDS; BOROSILICATE GLASS; CRYSTAL ORIENTATION; MAGNETRON SPUTTERING; NITROGEN; PRESSURE EFFECTS; RESIDUAL STRESSES; SPUTTER DEPOSITION; STRESS ANALYSIS; SUBSTRATES; X RAY ANALYSIS; X RAY DIFFRACTION;

ALUMINUM NITRIDE; COMPRESSIVE RESIDUAL STRESS; NITROGEN GAS PRESSURE; TENSILE RESIDUAL STRESS; TWO FACING TARGETS;

THIN FILMS;

EID: 0030217692     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/0040-6090(96)08633-6     Document Type: Article

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