Process induced residual stresses in isotropically conductive adhesive joints

IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing

Volumn 19, Issue 4, 1996, Pages 251-256

  Wu, Sean X ^a   Mei, Yuhai ^a   Yeh, Chao pin ^a   Wyatt, Karl W ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE JOINTS; CONDUCTIVE PLASTICS; DIMENSIONAL STABILITY; FINITE ELEMENT METHOD; FREQUENCY DOMAIN ANALYSIS; MECHANICAL TESTING; PLASTIC ADHESIVES; RESIDUAL STRESSES; STRESS ANALYSIS; STRESS RELAXATION; TIME DOMAIN ANALYSIS; VISCOELASTICITY;

CONDUCTIVE ADHESIVE JOINTS; SOFTWARE PACKAGE ABAQUS;

PRINTED CIRCUIT MANUFACTURE;

EID: 0030258411     PISSN: 10834400     EISSN: None     Source Type: Journal    
DOI: 10.1109/3476.558551     Document Type: Article

References (6)

1. A. O. Ogunjimi A review of the impact of conductive adhesive technology on the interconnection J. Electron. Manufact. 2 3 109 118 June 1992
2. J. Liu Reliability of surface-mounted anisotropically conductive adhesive joints Circuit World 19 4 4 8 1993
3. L. Li Electric, structure, and processing properties of electrically conductive adhesives IEEE Trans. Comp., Hybrids, Manufact. Technol. 16 843 851 Dec. 1993 33 6773 273683
4. D. D. Chang An overview and evaluation of anisotropically conductive adhesive films for fine pitch electronic assembly IEEE Trans. Comp., Hybrids, Manufact. Technol. 16 828 834 Dec. 1993 33 6773 273681
5. D. C. Whalley A comparison of the behavior of isotropic and anisotropic conducting adhesives Proc. ASME Winter Meeting 65 81 91 1993
6. R. M. Christensen Theory of Viscoelastics: An Introduction 2nd 1982 Academic New York