Microcalorimetry applications of a surface micromachined bolometer-type thermal probe

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 18, Issue 6, 2000, Pages 3600-3603

  Li, Mo Huang ^a   Gianchandani, Yogesh B ^a,b  

^a University of Wisconsin Madison   (United States)

^b NONE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOLOMETERS; METALLIC FILMS; MICROMACHINING; PHOTORESISTORS; POLYIMIDES; PROBES; SPUTTER DEPOSITION; THERMAL CONDUCTIVITY OF SOLIDS;

MICROCALORIMETRY; THERMAL PROBES;

CALORIMETRY;

EID: 0034316437     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1313581     Document Type: Article

References (16)

1. C. C. Williams and H. K. Wickramasinghe, Appl. Phys. Lett. 49, 1587 (1986).
2. R. B. Dinwiddie, R. J. Pylkki, and P. E. West, Therm. Conduct. 22, 668 (1994).
3. A. Hammiche, H. M. Pollock, M. Song, and D. J. Hourston, Meas. Sci. Technol. 7, 142 (1996).
4. K. Luo, Z. Shi, J. Varesi, and A. Majumdar, J. Vac. Sci. Technol. B 15, 349 (1997).
5. Y. Suzuki, Jpn. J. Appl. Phys., Part 2 35, L352 (1996).
6. T. Leinhos, M. Stopka, and E. Oesterschulze, Appl. Phys. A: Mater. Sci. Process. 66, S65 (1998).
7. A. Majumdar and J. Varesi, J. Heat Transfer 120, 297 (1998).
8. Y. B. Gianchandani and K. Najafi, IEEE Trans. Electron Devices 44, 1857 (1997).
9. M.-H. Li, J. J. Wu, and Y. B. Gianchandani, Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS '00), Miyazaki, Japan, January 2000, pp. 763-768.
10. A. Hammiche, D. J. Hourston, H. M. Pollock, M. Reading, and M. Song, J. Vac. Sci. Technol. B 14, 1486 (1996).
11. L. E. Ocola, D. Fryer, G. Reynolds, A. Krasnoperova, and F. Cerrina, Appl. Phys. Lett. 68, 717 (1996).
12. D. Fryer, J. de Pablo, and P. Nealey, Proc. SPIE 3333, 1031 (1998).
13. V. Kaajakari and A. Lal, Proc. The Tenth International Conference on Solid-State Sensors and Actuators (Transducers '99) June 1999, pp. 212-215.
14. M. Ataka, A. Omodaka, N. Takeshima, and H. Fujita, J. Microelectromech. Syst. 2, 146 (1993).
15. S. L. Morton, F. L. Degertekin, and B. T. Khuri-Yakub, IEEE Trans. Semicond. Manuf. 12, 332 (1999).
16. L. Que and Y. B. Gianchandani, J. Vac. Sci. Technol. B, these proceedings.