High performance scanning thermal probe using a low temperature polyimide-based micromachining process

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2000, Pages 763-768

  Li, M H ^a   Wu, J J ^a   Gianchandani, Y B ^a  

^a UNIVERSITY OF WISCONSIN MADISON   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; INTEGRATED CIRCUIT MANUFACTURE; MICROMACHINING; POLYIMIDES; SCANNING; SENSORS; THERMAL CONDUCTIVITY OF SOLIDS; THERMOPILES;

SCANNING THERMAL PROBES;

PROBES;

EID: 0033727385     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (17)