Stresses in bi-metal thermostats

Journal of Applied Mechanics, Transactions ASME

Volumn 53, Issue 3, 1986, Pages 657-660

  Suhir, E ^a  

^a LUCENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

PLATES - STRESSES; STRESSES - SHEAR;

BI-METAL THERMOSTATS; STRESS DISTRIBUTION;

THERMOSTATS;

EID: 0022787978     PISSN: 00218936     EISSN: 15289036     Source Type: Journal    
DOI: 10.1115/1.3171827     Document Type: Article

References (4)

1. Boley, B. A., and Weiner, J. H., (1960), Theory of Thermal Stresses, Wiley.
2. Chen, W. T., and Nelson, C. W., (1979), “Thermal Stresses in Bonded Joints,” IBM J. Res. Develop., Vol. 23, No. 2, pp. 179-187.
3. Glascock, H. H., and Webster, H. F., (1984), “Structural Copper: A Pliable High Conductance Material for Bonding to Silicon Power Devices,” IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. CHMT-6, No. 4.
4. Timoshenko, S. P., (1925), “Analysis of Bi-Metal Thermostats,” Journal of the Optical Society of America, Vol. 11, pp. 233-255.