Effects of peeling stresses in bimaterial assembly

Journal of Electronic Packaging, Transactions of the ASME

Volumn 113, Issue 4, 1991, Pages 431-433

  Mirman, Ilya B ^a  

^a STANFORD UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EPOXY RESINS; NICKEL AND ALLOYS;

BIMATERIAL ASSEMBLIES; PEELING STRESSES; PLASTIC ULTEM-1000;

ELECTRONICS PACKAGING;

EID: 0026401947     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2905433     Document Type: Article

References (10)

1. Tummala, R., and Rymaszewski, E., Microelectronics Packaging Handbook, Van Nostrand, 1988.
2. Gerstle, F., and Chambers, R., “Analysis of End Stresses in Glass-Metal Bimaterial Strips,” Winter Annual Meeting of the ASME, 1987.
3. Grimado, P. B., “Interlaminar Thermoelastic Stresses in Layered Beams,” Journal of Thermal Stresses, Vol. 1, 1978, pp. 75-86.
4. Mirman, B. A., and Knecht, S., “Creep Strains in an Elongated Bond Layer,” IEEE Trans, on Comp., Hybrids, and Manuf Tech., Vol. 13, No. 4, 1990, pp. 914-928.
5. Suhir, E., “Calculated Thermally Induced Stresses in Adhesively Bonded and Soldered Assemblies,” Int. Symp. Microelectr., 1986, pp. 383-392.
6. Kovar data sheet, Engineering Alloys Digest, 1953.
7. ULTEM-1000 data sheet, General Electric Plastics Division, 1990.
8. TW-DEVCON, Billerica, MA 01821.
9. Pendleton, R., TW-DEVCON, Private Communication, Aug. 1990.
10. Pendleton, R., Facsimile transmission of graph “Shear Stress vs. Temperature,” Aug. 1990.