THERMAL STRESS IN BONDED JOINTS.

IBM J Res Dev

Volumn 23, Issue 2, 1979, Pages 179-188

  Chen, William T ^a   Nelson, Carl W ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

THERMAL VARIABLES MEASUREMENT;

ELECTRON DEVICE MANUFACTURE;

EID: 0018444760     PISSN: 00188646     EISSN: None     Source Type: Journal    
DOI: 10.1147/rd.232.0179     Document Type: Article

References (20)