Approximate evaluation of the elastic thermal stresses in a thin film fabricated on a very thick circular substrate

Journal of Electronic Packaging, Transactions of the ASME

Volumn 116, Issue 3, 1994, Pages 171-176

  Suhir, E ^a  

^a LUCENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFERENTIAL EQUATIONS; LOADS (FORCES); MATHEMATICAL MODELS; SHEAR STRESS; STRAIN; STRESS ANALYSIS; SUBSTRATES; THERMAL STRESS;

CIRCULAR SUBSTRATE; ELASTIC THERMAL STRESSES; SHEARING LOAD; SUBSTRATE COMPLIANCE;

THICK FILMS;

EID: 0028495448     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2905682     Document Type: Article

References (13)

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