Improved analytical estimate of global cte mismatch displacement in areal-array solder joints

Journal of Electronic Packaging, Transactions of the ASME

Volumn 119, Issue 4, 1997, Pages 218-227

  Heinrich, S M ^a   Shakya, S ^a   Lee, P S ^b  

^a Marquette University   (United States)

^b ROCKWELL AUTOMATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ARRAYS; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; SHEAR STRESS; THERMAL EXPANSION;

AREAL ARRAY SOLDER JOINTS; COEFFICIENT OF THERMAL EXPANSION (CTE);

SOLDERED JOINTS;

EID: 0031344599     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792240     Document Type: Article

References (21)

1. Boresi, A. P., and Chong, K. P., 1987, Elasticity in Engineering Mechanics, Elsevier Science Publishing, Inc., New York.
2. Buratynski, E. K., 1997, “Analysis of Bending and Shearing of Tri-Layer Laminations for Solder Joint Reliability,” Advances in Electronic Packaging 1997, Vol. 2, ASME Publ. EEP-Vol. 19-2, pp. 1671-1678.
3. Chen, W. T., and Nelson, C. W., 1979, “Thermal Stress in Bonded Joints,” IBM J. Res. Develop., Vol. 23, No. 2, pp. 179-188.
4. Gektin, V., Bar-Cohen, A., and Witzman, S., 1997, “Coffin-Manson Based Fatigue Analysis of Underfilled DCA,” Advances in Electronic Packaging 1997, Vol. 2, ASME Publ. EEP-Vol. 19-2, pp. 1655-1661.
5. Goland, M., and Reissner, E, 1944, ‘ ‘The Stresses in Cemented Joints,” ASME Journal of Applied Mechanics, Vol. 11, pp. 17-27.
6. Han, B., Guo, Y., Lim, C. K., and Caletka, D., 1996, “Verification of Numerical Models Used in Microelectronics Packaging Design by Interferometric Displacement Measurement Methods,” ASME Journal of Electronic Packaging, Vol. 118, No. 3, pp. 157-163.
7. Heinrich, S. M., 1994, “Prediction of Solder Joint Geometry,” Chap. 5 in The Mechanics of Solder Alloy Interconnects, D. R. Frear et al. eds., Van Nostrand Reinhold, pp. 158-198.
8. Heinrich, S. M., Shakya, S., Wang, Y., Lee, P. S., and Schroeder, S. A., 1996a, “Improved Yield and Performance of Ball-Grid Array Packages: Design and Processing Guidelines for Uniform and Nonuniform Arrays,” IEEE Trans., CPMT, Part B: Advanced Packaging, Vol. 19, No. 2, pp. 310-319.
9. Heinrich, S. M Schaefer, M Schroeder, S. A., and Lee, P. S., 1996b, “Prediction of Solder Joint Geometries in Array-Type Interconnects,” ASME Journal of Electronic Packaging, Vol. 118, No. 3, pp. 114-121.
10. Heinrich, S. M., and Lee, P.S., 1997, “Solder Geometry Prediction in Electronic Packaging: An Overview,” Advances in Electronic Packaging 1997, Vol. 2, ASME Publ. EEP-Vol. 19-2, pp. 1371-1378.
11. Le Gall, C. A., Qu, J., and McDowell, D. L., 1997, “Influence of Die Size on the Magnitude of Thermomechanical Stresses in Flip Chips Directly Attached to Printed Wiring Board,” Advances in Electronic Packaging 1997, Vol. 2, ASME Publ. EEP-Vol. 19-2, pp. 1663-1670.
12. Mirman, B. A., and Knecht, S., 1990, “Creep Strains in an Elongated Bond Layer,” IEEE Trans. Components, Hybrids, and Manufacturing Technology, Vol. 13, No. 4, December 1990, pp. 914-928.
13. Mirman, B., 1995, “The Mechanics of the Edge Delamination Test,” ASME Journal of Electronic Packaging, Vol. 117, No. 4, pp. 340-343.
14. Mirman, B., and Mirman, I., 1992, “Thermal Stresses in Axisymmetric Bimaterial Assemblies: Microelectronic Applications,” Advance in Electronic Packaging 1992, Vol. 1, ASME Publ. EEP-Vol. 1-1, pp. 425-435.
15. Shakya, S., 1995, “Simplified Stress Analysis of Axisymmetric Solder Joint Under Thermal Loading,” M.S. thesis, Marquette University, Milwaukee, WI.
16. Swanson, J. A., Heinrich, S. M., and Lee, P. S., 1997, “An Elastoplastic Beam Model for Column-Grid-Array Solder Interconnects,” Design and Reliability of Solders and Solder Interconnections, R. K. Mahidhara et al., eds., The Minerals, Metals & Materials Society, pp. 295-303; presented at the 1997 TMS Annual Meeting, Orlando, FL.
17. Suhir, E., 1986, “Calculated Thermally Induced Stresses in Adhesively Bonded and Soldered Assemblies” Proc., 1986 International Symposium on Microelectronics, Atlanta, GA, pp. 383-392.
18. Taylor, T. C., and Yuan, F. L., 1963, “Thermal Stress and Fracture in Shear Constrained Semiconductor Structure,” IRE Trans. Electron. Devices ED9, pp. 303-308.
19. Timoshenko, S., 1925, “Analysis of Bi-metal Thermostats,” J. Opt. Soc.Amer., Vol. 11, pp. 233-255.
20. Tuma, J. J., 1987, Engineering Mathematics Handbook, 3rd ed., McGraw-Hill, New York, pp. 196-198.
21. Völkersen, O., 1938, Luftfahrtforschung, Vol. 15, p. 41