Asymptotic expansions for the thermal stresses in bonded semi-infinite bimaterial strips

Journal of Electronic Packaging, Transactions of the ASME

Volumn 113, Issue 2, 1991, Pages 173-177

  Lee, Mikyoung ^a   Jasiuk, I ^a  

^a MICHIGAN STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

SHEET AND STRIP METAL - BONDING;

AIRY STRESS FUNCTION METHOD; BONDED SEMI-INFINITE BIMATERIAL STRIPS; THERMAL STRESS ASYMPTOTIC EXPANSIONS;

BONDING;

EID: 0026169569     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2905383     Document Type: Article

References (25)

1. Aleck, B. J., 1949, “Thermal Stresses in a Rectangular Plate Clamped along the Edge,” ASME Journal of Applied Mechanics, Vol. 16, pp. 118-122.
2. Blanchard, J. P., and Ghoniem, N. M., 1989, “Relaxation of Thermal Stress Singularities in Bonded Viscoelastic Quarter Planes,” ASME Journal of Applied Mechanics, Vol. 56, pp. 756-762.
3. Blech, J. J., and Kantor, Y., 1984, “An Edge Problem Having no Singularity at the Corner,” Computers and Structures, Vol. 18, pp. 609-617.
4. Bogy, D. B., 1970, “On the Problem of Edge-bonded Elastic Quarter Planes Loaded at the Boundary,” International Journal of Solids and Structures, Vol. 6, pp. 1287-1313.
5. Bogy, D. B, 1968, “Edge-bonded Dissimilar Orthogonal Elastic Wedges under Normal and Shear Loading,” ASME Journal of Applied Mechanics, Vol. 35, pp. 460-466.
6. Chen, D., Cheng, S., and Gerhart, T. D., 1982, “Thermal Stresses in Laminated Beams,” Journal of Thermal Stresses, Vol. 5, pp. 67-84.
7. Chen, W. T., and Nelson, C. W., 1979, “Thermal Stress in Bolted Joints,” IBM Journal of Research and Development, Vol. 23, pp. 178-188.
8. Dempsey, J. P., and Sinclair, G. B., 1981, “On the Singular Behavior at the Vertex of a Bi-material Wedge,” Journal of Elasticity, Vol. 11, pp. 317-327.
9. Dundurs, J., 1969, discussion, ASME Journal of Applied Mechanics, Vol. 36, pp. 650-652.
10. Eischen, J. W., Chung, C., and Kim, J. H., 1990, “Realistic Modeling of Edge Effect Stresses in Bimaterial Elements,” ASME Journal of Electronic Packaging, Vol. 112, pp. 16-23.
11. Gerstle, F. P., and Chambers, R. S., 1987, “Analysis of End Stresses in Glass-Metal Bi-Material Strips,” Technology of Glass, Ceramic or Glass-Ceramic to Metal Sealing, eds. W. E. Moddeman, C. W. Merten, and D. P. Kramer, ASME, NY, pp. 47-59.
12. Hein, V. L., and Erdogan, F., 1971, “Stress Singularities in a Two-Material Wedge,” International Journal of Fracture Mechanics, Vol. 7, pp. 317-330.
13. Hess, M. S., 1969, “The End Problem for a Laminated Elastic Strip—I. The General Solution,” Journal of Composite Materials, Vol. 3, pp. 262-292.
14. Hess, M. S., 1969, “The End Problem for a Laminated Elastic Strip—II. Differential Expansion Stresses,” Journal of Composite Materials, Vol. 3, pp. 630-641.
15. Kuo, A. Y., 1989, “Thermal Stresses at the Edge of Bimetallic Thermostat,” ASME Journal of Applied Mechanics, Vol. 56, pp. 585-589.
16. Lau, J. H., 1989, “A Note on the Calculation of Thermal Stresses in Electronic Packaging by Finite Element Methods,” ASME Journal of Electronic Packaging, Vol. 3, pp. 313-320.
17. Marsden, J. E., 1973, Basic Complex Analysis, Freeman and Co., San Francisco.
18. Muskhelishvili, N.I., 1953, Some Basic Problems of the Mathematical Theory of Elasticity, P. Noordhoff Ltd., Groningen, Holland.
19. Nehari, Z., 1952, Conformal Mapping, McGraw-Hill, New York.
20. Razaqpar, A. G., 1987, Discussion on Suhir’s paper (1986), ASME Journal of Applied Mechanics, Vol. 54, p. 479.
21. Suhir, E., 1989, “Interfacial Stresses in Bimetal Thermostats,” ASME Journal of Applied Mechanics, Vol. 56, pp. 595-600.
22. Suhir, E., 1986, “Stress in Bi-metal Thermostat,” ASME Journal of Applied Mechanics, Vol. 53, pp. 657-660.
23. Tichtmarsh, E. C., 1948, Introduction to the Theory of Fourier Integrals, 2nd ed., Oxford, London.
24. Timoshenko, S., 1925, “Analysis of Bi-metal Thermostats,” Journal of Optical Society of America, Vol. 11, pp. 595-600.
25. Tranter, C. J., 1966, Integral Transforms in Mathematical Physics, Wiley, New York.