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Volumn 6, Issue 2, 1999, Pages 283-309

Opportunities for materials modeling in microelectronics: Programmed rate chemical vapor deposition

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL VAPOR DEPOSITION; COMPUTER SIMULATION; CONTINUUM MECHANICS; CRYSTAL MICROSTRUCTURE; FILM GROWTH; MICROELECTRONICS; NUCLEATION; PROCESS ENGINEERING; SEMICONDUCTING ALUMINUM COMPOUNDS; SURFACE ROUGHNESS; THIN FILMS; TRANSPORT PROPERTIES;

EID: 0033316542     PISSN: 09281045     EISSN: None     Source Type: Journal    
DOI: 10.1023/a:1008762530690     Document Type: Article
Times cited : (6)

References (68)
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  • 18
    • 0141689703 scopus 로고
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  • 21
    • 0343783716 scopus 로고    scopus 로고
    • note
    • EVOLVE is a deposition, etch and thin film flow process simulator daveloped under the direction of T.S. Cale; version 5.0i released June 1999.
  • 22
    • 0001327720 scopus 로고
    • Advanced Metallization and Processing for Semiconductor Devices and Circuits - II
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  • 55
    • 0031355228 scopus 로고    scopus 로고
    • Polycrystalline Thin Films-Structure, Texture, Properties and Applications III
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    • Yang, D., Jonnalagadda, R., Mahadev, V., Cale, T.S., Hillman, J.T. and Foster, R.F., In Im, J., Yalisove, S., Adams, B., Zhu, Y. and Chen, F.-R. (Eds.), Polycrystalline Thin Films-Structure, Texture, Properties and Applications III, MRS Proc. 472, Pittsburgh, PA, 1997, pp. 337-342.
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  • 57
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    • free application software available on the website of the Division of Computer Research and Technology, National Institutes of Health
    • Image Analysis Software version 1.60, free application software available on the website of the Division of Computer Research and Technology, National Institutes of Health (at http://www.nih.gov).
    • Image Analysis Software Version 1.60
  • 63
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    • Evolution of Thin Film and Surface Structure and Morphology
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    • (1995) MRS Symp. Proc. , vol.355 , pp. 575
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  • 68
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    • a low pressure deposition and etch process simulator written, with funding from the Semi conductor Research Corporation, the National Science Foundation and Motorola
    • Users' Guide for EVOLVE, a low pressure deposition and etch process simulator written by T.S. Cale, with funding from the Semi conductor Research Corporation, the National Science Foundation and Motorola
    • Users' Guide for EVOLVE
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.