Fabrication of arrays of Schottky diodes using microtransfer molding

Sensors and Actuators, A: Physical

Volumn 75, Issue 1, 1999, Pages 65-69

  Hu, Junmin ^a   Deng, Tao ^a   Beck, R G ^b   Westervelt, R M ^b   Whitesides, George M ^a  

^a HARVARD UNIVERSITY   (United States)

^b HARVARD UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ARRAYS; CURRENT VOLTAGE CHARACTERISTICS; LITHOGRAPHY; MICROELECTRONICS; MOLDING; SCHOTTKY BARRIER DIODES; SEMICONDUCTOR DEVICE MANUFACTURE;

MICROTRANSFER MOLDING; PATTERN TRANSFER; SOFT LITHOGRAPHY;

MICROSENSORS;

EID: 0032675921     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(99)00044-8     Document Type: Article

References (22)

1. Emmelius M., Pawlowski G., Vollmann H.W. Materials for optical data storage. Angew. Chem., Int. Ed. Engl. 28:1989;1445-1471.
2. Lehmann H.W., Widmer R., Ebnoether M., Wokaun A., Meier R., Ebnoether M. Fabrication of submicron crossed square wave gratings by dry etching and thermoplastic replication techniques. J. Vac. Sci. Technol. B. 1:1983;1207-1210.
3. 2 storage density fabricated using nanoimprint lithography and read with proximal probe. Appl. Phys. Lett. 71:1997;3174-3176.
4. Chou S.Y., Krauss P.R., Renstrom P.J. Imprint lithography with 25-nanometer resolution. Science. 272:1996;85-87.
5. Haverkorn van Rijsewijk H.C., Legierse P.E.J., Thomas G.E. Manufacture of laser vision video discs by a photopolymerization process. Philips Tech. Rev. 40:1982;287-297.
6. Terris B.D., Mamin H.J., Best M.E., Logan J.A., Rugar D., Rishton S.A. Nanoscale replication for scanning probe data storage. Appl. Phys. Lett. 69:1996;4262-4264.
7. Haisma J., Verheijen M., van den Heuvel K., van den Berg J. Mold-assisted nanolithography: a process for reliable pattern replication. J. Vac. Sci. Tech. B. 14:1996;4124-4128.
8. Masuda H., Fukuda K. Ordered metal nanohole arrays made by a two-step replication of honeycomb structures of anodic alumina. Science. 268:1995;1466-1468.
9. Hoyer P. Semiconductor nanotube formation by a two-step template process. Adv. Mater. 8:1996;857-859.
10. Huber T.E., Luo L. Far-infrared propagation in metal wire microstructures. Appl. Phys. Lett. 70:1997;2502-2504.
11. Xia Y., Whitesides G.M. Soft lithography. Angew. Chem., Int. Ed. Engl. 37:1998;550-575.
12. S. Brittain, K. Paul, X.-M. Zhao, G.M. Whitesides, Soft lithography and microfabrication, Physics World May (1998) 31-36.
13. Hu J.M., Beck R.G., Westervelt R.M., Whitesides G.M. The use of soft lithography to fabricate arrays of Schottky diodes. Adv. Mater. 10:1998;574-577.
14. Hu J.M., Beck R.G., Deng T., Westervelt R.M., Maranowski K.D., Gossard A.C., Whitesides G.M. Using soft lithography to fabricate GaAs/AlGaAs heterostructure field effect transistors. Appl. Phys. Lett. 71:1997;2020-2022.
15. N.L. Jeon, J.M. Hu, G.M. Whitesides, M.K. Erhardt, R.G. Nuzzo, Fabrication of silicon MOSFETs using soft lithography, Adv. Mater. (1998) in press.
16. Kim E., Xia Y., Whitesides G.M. Polymer microstructures formed by moulding in capillaries. Nature. 376:1995;581-584.
17. Zhao X.-M., Xia Y., Whitesides G.M. Fabrication of three-dimensional microstructures: microtransfer molding. Adv. Mater. 8:1996;837-840.
18. Qin D., Xia Y., Whitesides G.M. Rapid prototyping of complex structures with feature sizes larger than 20 μm. Adv. Mater. 8:1996;917-919.
19. R.S. Muller, T.I. Kamins, Device Electronics for Integrated Circuits, 2nd edn., Wiley, New York, 1986.
20. D.L. Schilling, C. Belove, Electronic circuits, discrete and integrated, in: S.W. Director (Ed.), McGraw-Hill Series in Electrical Engineering, 2nd edn., McGraw-Hill, New York, 1979.
21. Rogers J.A., Paul K.E., Whitesides G.M. Quantifying distortions in soft lithography. J. Vac. Sci. Technol. B. 16:1998;88-97.
22. Rogers J.A., Bao Z., Raju V.R. Nonphotolithographic fabrication of organic transistors with micron feature sizes. Appl. Phys. Lett. 72:1998;2716-2718.