Effects of discharge frequency on plasma characteristics and etching characteristics in high density cl<2 plasma: comparison of ultrahigh-frequency plasma and radio-frequency plasma

IEEE Transactions on Plasma Science

Volumn 26, Issue 6, 1998, Pages 1621-1627

  Samukawa, Seiji ^a   Akashi, Haruaki ^b  

^a NEC CORPORATION   (Japan)

^b NATIONAL DEFENSE ACADEMY   (Japan)

Author keywords

Dissociation; Electron energy distribution function; Ionization; Large scaled plasma source; Plasma etchings; Reactive plasmas; Ultrahigh frequency plasma

Indexed keywords

DISSOCIATION; ELECTRIC DISCHARGES; ELECTRON ENERGY LEVELS; FUNCTIONS; IONIZATION OF GASES; PLASMA DENSITY; PLASMA ETCHING; PLASMA SOURCES; POLYCRYSTALLINE MATERIALS; SEMICONDUCTING SILICON; SEMICONDUCTING SILICON COMPOUNDS; SILICA;

RADIO-FREQUENCY PLASMAS; ULTRAHIGH-FREQUENCY PLASMAS;

CHLORINE;

EID: 0032317517     PISSN: 00933813     EISSN: None     Source Type: Journal    
DOI: 10.1109/27.747879     Document Type: Article

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