High frequency flip-chip bonding technologies and their application to microwave/millimeter-wave ICs

IEICE Transactions on Electronics

Volumn E81-C, Issue 6, 1998, Pages 810-818

  Sakai, Hiroyuki ^a   Yoshida, Takayuki ^a   Sagawa, Morikazu ^a  

^a PANASONIC CORPORATION   (Japan)

Author keywords

Bump; Flip chip; Hic (hybrid 1c); Microwave; Millimeter wave

Indexed keywords

BONDING; HYBRID INTEGRATED CIRCUITS; INTEGRATED CIRCUIT LAYOUT; MILLIMETER WAVE DEVICES; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS;

MICRO BUMP BONDING (MBB); MILLIMETER FLIP CHIP INTEGRATED CIRCUITS (MFIC); STUD BUMP BONDING (SBB);

FLIP CHIP DEVICES;

EID: 0032094468     PISSN: 09168524     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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