Miniaturized receiver front-end hybrid ICs for mobile communication equipment using flip-chip bonding technology

Volumn , Issue , 1995, Pages 15-20

  Itoh, Junji ^a   Yagi, Yoshihiko ^a   Takahashi, Kazuaki ^a   Takemoto, Makoto ^a   Sagawa, Morikazu ^a  

^a Discovery Research Laboratories II   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

FIELD EFFECT TRANSISTORS; FREQUENCY ALLOCATION; GAIN CONTROL; HYBRID INTEGRATED CIRCUITS; INTEGRATED CIRCUIT MANUFACTURE; INTEGRATED CIRCUIT TESTING; MINIATURE RADIO EQUIPMENT; PRINTED CIRCUIT DESIGN; RADIO RECEIVERS; SIGNAL TO NOISE RATIO;

CONVERSION GAIN; DISSIPATION CURRENT; FLIP CHIP BONDING TECHNOLOGY; MINIATURIZATION; MINIATURIZED RECEIVER FRONT END HYBRID INTEGRATED CIRCUITS; NOISE FIGURE;

MOBILE RADIO SYSTEMS;

EID: 0029236178     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)