60 GHz flip-chip assembled MIC design considering chip-substrate effect

IEEE MTT-S International Microwave Symposium Digest

Volumn 2, Issue , 1997, Pages 447-450

  Arai, Y ^a   Sato, M ^a   Yamada, H T ^a   Hamada, T ^a   Nagai, K ^a   Fujishiro, H I ^a  

^a OKI ELECTRIC INDUSTRY CO   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTROMAGNETIC FIELD EFFECTS; EQUIVALENT CIRCUITS; FLIP CHIP DEVICES; FREQUENCY MULTIPLYING CIRCUITS; HIGH ELECTRON MOBILITY TRANSISTORS; INTEGRATED CIRCUIT LAYOUT; MICROWAVE AMPLIFIERS; SEMICONDUCTOR DEVICE MODELS; SEMICONDUCTOR DEVICE STRUCTURES; SUBSTRATES;

CHIP SUBSTRATE EFFECTS;

MONOLITHIC INTEGRATED CIRCUITS;

EID: 0030689163     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)