Novel millimeter-wave IC on Si substrate using flip-chip bonding technology

IEEE MTT-S International Microwave Symposium Digest

Volumn 3, Issue , 1994, Pages 1763-1766

  Sakai, Hiroyuki ^a   Ota, Yorito ^a   Inoue, Kaoru ^a   Yoshida, Takayuki ^a   Takahashi, Kazuaki ^a   Fujita, Suguru ^a   Sagawa, Morikazu ^a  

^a PANASONIC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

AMPLIFIERS (ELECTRONIC); COMPUTATIONAL METHODS; DIELECTRIC FILMS; ELECTRIC VARIABLES MEASUREMENT; FLIP CHIP DEVICES; HETEROJUNCTIONS; MICROSTRIP DEVICES; MICROWAVE POWER TRANSMISSION; MILLIMETER WAVES; SEMICONDUCTING SILICON; TRANSISTORS;

HYBRID INTEGRATED CIRCUITS; SEMICONDUCTOR BONDING;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0028076723     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)