Application of a flip-chip-bonding technique to GHz-band SAW filters for mobile communication

IEICE Transactions on Electronics

Volumn E76-C, Issue 6, 1993, Pages 993-999

  Onishi, Keiji ^a   Seki, Shun ichi ^a   Taguchi, Yutaka ^a   Bessho, Yoshihiro ^a   Eda, Kazuo ^a   Ishida, Toru ^a  

^a PANASONIC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; ELECTRIC PROPERTIES; FABRICATION; FLIP CHIP DEVICES; MICROWAVE DEVICES; MICROWAVES; MOBILE TELECOMMUNICATION SYSTEMS;

ELECTRICAL CHARACTERISTIC; FLIP CHIP BONDING TECHNIQUE; FREQUENCY CHARACTERISTICS; STUD BUMP BONDING TECHNIQUE; WIRE BONDING TECHNIQUE;

ACOUSTIC SURFACE WAVE FILTERS;

EID: 0027614529     PISSN: 09168524     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (12)