Novel millimeter-wave IC on Si substrate using flip-chip bonding technology

IEICE Transactions on Electronics

Volumn E78-C, Issue 8, 1995, Pages 971-978

  Sakai, Hiroyuki ^a   Ota, Yorito ^a   Inoue, Kaoru ^a   Yoshida, Takayuki ^a   Takahashi, Kazuaki ^a   Fujita, Suguru ^a   Sagawa, Morikazu ^a  

^a PANASONIC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; ELECTROMAGNETIC FIELD THEORY; FLIP CHIP DEVICES; HETEROJUNCTION BIPOLAR TRANSISTORS; INTEGRATED CIRCUIT MANUFACTURE; MICROSTRIP LINES; MILLIMETER WAVE DEVICES; SEMICONDUCTING ALUMINUM COMPOUNDS; SEMICONDUCTING INDIUM COMPOUNDS; SEMICONDUCTING SILICON; SUBSTRATES;

ELECTROMAGNETIC FIELD ANALYSIS; FLIP CHIP BONDING TECHNOLOGY; MICRO BUMP BONDING TECHNOLOGY; MILLIMETER WAVE INTEGRATED CIRCUITS;

INTEGRATED CIRCUITS;

EID: 0029356723     PISSN: 09168524     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (12)