Stud-bump-bonding technique for high density multi-chip-module

IEEE/CHMT European International Electronic Manufacturing Technology Symposium

Volumn , Issue , 1993, Pages 362-365

  Bessho, Yoshihiro ^a   Tomura, Yoshihiro ^a   Hakotani, Yasuhiko ^a   Tsukamoto, Masahide ^a   Ishida, Toru ^a   Omoya, Kazunori ^a  

^a PANASONIC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; ELECTRONICS PACKAGING; LSI CIRCUITS;

BONDING RESISTANCE; BUMP FORMATION; CERAMIC SUBSTRATES; HIGH DENSITY PACKAGING; MULTICHIP MODULES; STUMP BUMP BONDING;

ELECTRONIC EQUIPMENT MANUFACTURE;

EID: 0027852055     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)