MCM packaging for present- and next-generation high clock-rate digital- and mixed-signal electronic systems: areas for development

IEEE Transactions on Microwave Theory and Techniques

Volumn 45, Issue 10 PART 2, 1997, Pages 1819-1835

  Gilbert, Barry K ^a   Pan, Guang Wen ^a  

^a MAYO CLINIC   (United States)

Author keywords

Aid converters; Digital receivers; Digital signal processors; Electromagnetic modeling; Multichip modules; S parameters

Indexed keywords

COMPUTER SIMULATION; DIGITAL DEVICES; DIGITAL SIGNAL PROCESSING; MULTICHIP MODULES;

AID CONVERTERS; S-PARAMETERS;

ELECTRONICS PACKAGING;

EID: 0031245838     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/22.641780     Document Type: Article

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