High density, high performance MCM-D/C package: a design, electrical, and process perspective

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1996, Pages 821-828

  Ellsworth, M J ^a   Hamel, H ^a   Perfecto, E D ^a   Wassick, T ^a  

^a IBM MICROELECTRONICS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; APPLICATION SPECIFIC INTEGRATED CIRCUITS; CAPACITORS; CERAMIC MATERIALS; ELECTRIC WIRING; FREQUENCY DOMAIN ANALYSIS; MICROPROCESSOR CHIPS; MULTICHIP MODULES; PERSONAL COMPUTERS; SEMICONDUCTING SILICON; THIN FILMS; TIME DOMAIN ANALYSIS;

CONTROLLED COLLAPSE CHIP CONNECTION; ELECTRICAL CHARACTERIZATION; ELECTRICAL DESIGN; ELECTRICAL PERFORMANCE; PROCESSOR MODULE;

ELECTRONICS PACKAGING;

EID: 0029723944     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (9)