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Volumn 32, Issue 11, 1985, Pages 2408-2414

On the Parasitic Capacitances of Multilevel Parallel Metallization Lines

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC MEASUREMENTS - CAPACITANCE;

EID: 0022151724     PISSN: 00189383     EISSN: 15579646     Source Type: Journal    
DOI: 10.1109/T-ED.1985.22287     Document Type: Article
Times cited : (31)

References (14)
  • 1
    • 0020704286 scopus 로고
    • Simple formulas for two- and three-di-mensional capacitances
    • Feb.
    • T. Sakurai and K. Tamaru, “Simple formulas for two- and three-di-mensional capacitances,” IEEE Trans. Electron Devices, vol. ED-30, pp. 183–185, Feb. 1983.
    • (1983) IEEE Trans. Electron Devices , vol.ED-30 , pp. 183-185
    • Sakurai, T.1    Tamaru, K.2
  • 2
    • 0020244584 scopus 로고
    • Multidimensional simulation of VLSI wiring capacitance
    • P. E. Cotrell, E. M. Buturda, and D. R. Thomas, “Multidimensional simulation of VLSI wiring capacitance,” in IEDM Tech. Dig., pp. 548–551, 1982.
    • (1982) IEDM Tech. Dig. , pp. 548-551
    • Cotrell, P.E.1    Buturda, E.M.2    Thomas, D.R.3
  • 3
    • 0016994667 scopus 로고
    • Analytical IC metal-line capacitance formulas
    • Sept.; see also vol. MTT-25, p. 712, Aug. 1977
    • W. H. Chang, “Analytical IC metal-line capacitance formulas,” IEEE Trans. Microwave Theory Tech., vol. MTT-24, pp. 608–611, Sept. 1976; see also vol. MTT-25, p. 712, Aug. 1977.
    • (1976) IEEE Trans. Microwave Theory Tech. , vol.MTT-24 , pp. 608-611
    • Chang, W.H.1
  • 4
    • 0016655298 scopus 로고
    • Capacitance models for integrated circuit metallization wires
    • Dec.
    • A. E. Ruehli and P. A. Breennan, “Capacitance models for integrated circuit metallization wires,” IEEE J. Solid-State Circuits, vol. SC-10, no. 6, pp. 530–536, Dec. 1975.
    • (1975) IEEE J. Solid-State Circuits , vol.SC-10 , Issue.6 , pp. 530-536
    • Ruehli, A.E.1    Breennan, P.A.2
  • 5
    • 0015655358 scopus 로고
    • Accurate metallization capacitances for integrated circuits and packages
    • Aug.
    • A. E. Ruehli and P. A. Brennan, “Accurate metallization capacitances for integrated circuits and packages,” IEEE J. Solid-State Circuits, vol. SC-8, pp. 289–290, Aug. 1973.
    • (1973) IEEE J. Solid-State Circuits , vol.SC-8 , pp. 289-290
    • Ruehli, A.E.1    Brennan, P.A.2
  • 6
    • 0015158659 scopus 로고
    • Calculation of capacitance coefficients for a system of irregular finite conductors on a dielectric sheet
    • Nov.
    • P. D. Patel, “Calculation of capacitance coefficients for a system of irregular finite conductors on a dielectric sheet,” IEEE Trans. Microwave Theory Tech., vol. MTT-19, pp. 862–869, Nov. 1971.
    • (1971) IEEE Trans. Microwave Theory Tech. , vol.MTT-19 , pp. 862-869
    • Patel, P.D.1
  • 7
    • 0014710239 scopus 로고
    • Calculation of capacitance coefficients of multicon-ductor transmission lines in the presence of a dielectric interface
    • Jan.
    • W. T. Weeks, “Calculation of capacitance coefficients of multicon-ductor transmission lines in the presence of a dielectric interface,” IEEE Trans. Microwave Theory Tech., vol. MTT-18, pp. 35–43, Jan. 1970.
    • (1970) IEEE Trans. Microwave Theory Tech. , vol.MTT-18 , pp. 35-43
    • Weeks, W.T.1
  • 8
    • 0038524424 scopus 로고
    • Computation of impedance and attenuation of TEM-lines by finite difference methods
    • Nov.
    • M. V. Schneider, “Computation of impedance and attenuation of TEM-lines by finite difference methods,” IEEE Trans. Microwave Theory Tech., vol. MTT-13, pp. 793–800, Nov. 1965.
    • (1965) IEEE Trans. Microwave Theory Tech. , vol.MTT-13 , pp. 793-800
    • Schneider, M.V.1
  • 9
    • 0006672637 scopus 로고
    • The accuracy of the finite-difference solutions of La-place's equation
    • Oct.
    • J. W. Duncan, “The accuracy of the finite-difference solutions of La-place's equation,” IEEE Trans. Microwave Theory Tech., vol. MTT-15, pp. 575–581, Oct. 1967.
    • (1967) IEEE Trans. Microwave Theory Tech. , vol.MTT-15 , pp. 575-581
    • Duncan, J.W.1
  • 13
    • 84941510710 scopus 로고    scopus 로고
    • Parasitic capacitances between skewed conductors
    • accepted for publication in the
    • C. D. Taylor, G. N. Elkhouri, and T. E. Wade, “Parasitic capacitances between skewed conductors,” accepted for publication in the IEEE Trans. Electron Devices.
    • IEEE Trans. Electron Devices
    • Taylor, C.D.1    Elkhouri, G.N.2    Wade, T.E.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.