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Feb.
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Multidimensional simulation of VLSI wiring capacitance
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P. E. Cotrell, E. M. Buturda, and D. R. Thomas, “Multidimensional simulation of VLSI wiring capacitance,” in IEDM Tech. Dig., pp. 548–551, 1982.
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Analytical IC metal-line capacitance formulas
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Sept.; see also vol. MTT-25, p. 712, Aug. 1977
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W. H. Chang, “Analytical IC metal-line capacitance formulas,” IEEE Trans. Microwave Theory Tech., vol. MTT-24, pp. 608–611, Sept. 1976; see also vol. MTT-25, p. 712, Aug. 1977.
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Chang, W.H.1
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Dec.
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Aug.
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Ruehli, A.E.1
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Calculation of capacitance coefficients for a system of irregular finite conductors on a dielectric sheet
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Nov.
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P. D. Patel, “Calculation of capacitance coefficients for a system of irregular finite conductors on a dielectric sheet,” IEEE Trans. Microwave Theory Tech., vol. MTT-19, pp. 862–869, Nov. 1971.
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Patel, P.D.1
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Calculation of capacitance coefficients of multicon-ductor transmission lines in the presence of a dielectric interface
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Jan.
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W. T. Weeks, “Calculation of capacitance coefficients of multicon-ductor transmission lines in the presence of a dielectric interface,” IEEE Trans. Microwave Theory Tech., vol. MTT-18, pp. 35–43, Jan. 1970.
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Computation of impedance and attenuation of TEM-lines by finite difference methods
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Nov.
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M. V. Schneider, “Computation of impedance and attenuation of TEM-lines by finite difference methods,” IEEE Trans. Microwave Theory Tech., vol. MTT-13, pp. 793–800, Nov. 1965.
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Schneider, M.V.1
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The accuracy of the finite-difference solutions of La-place's equation
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Oct.
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J. W. Duncan, “The accuracy of the finite-difference solutions of La-place's equation,” IEEE Trans. Microwave Theory Tech., vol. MTT-15, pp. 575–581, Oct. 1967.
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