Case study: The design of a mixed-signal global positioning system receiver using multichip module packaging

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 19, Issue 1, 1996, Pages 215-223

  Zabinski, Patrick J ^b   Vickberg, Mark E ^b   Gilbert, Barry K ^a,b   Zucarelli, Philip J ^c   Weninger, Darren V ^c   Keller, Theodore W ^c   Yee, David M ^c  

^a IEEE

^b MAYO CLINIC   (United States)

^c MOTOROLA INC   (United States)

Author keywords

Global positioning system; MCM L; Microwave; Mixed signal

Indexed keywords

ASSEMBLY; ELECTRONICS PACKAGING; GLOBAL POSITIONING SYSTEM; LAMINATES; MICROWAVES; MULTICHIP MODULES; SUBSTRATES; SYSTEMS ANALYSIS;

DESIGN CONSTRAINTS; LAMINATED MULTICHIP MODULES; MIXED SIGNAL SYSTEM; SUBSTRATE SELECTION CRITERIA;

SIGNAL RECEIVERS;

EID: 0030081593     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.486505     Document Type: Article

References (6)

1. P. J. Zabinski, M. E. Vickberg, B. K. Gilbert, D. Yee, T. W. Keller, and D. V. Weninger, "Evolution through integration of current and emerging systems," in The Micro-Miniaturization of the Motorola Global Positioning System Receiver Using Multichip Modules, Institute of Navigation Proceedings of the National Technical Meeting. Parc Fifty Five Hotel, San Francisco, CA Jan. 20-22, 1993, pp. 589-594.
2. P. J. Zabinski, B. K. Gilbert, P. J. Zucarelli, D. V. Weninger, and T. W. Keller, "Mixed-signal MCM-L design using a global positioning system (GPS) receiver as an example," in Proc. ISHM 1994 Int. Conf. Multichip Modules, Denver, Colorado, Apr. 13-15, 1994, pp. 151-160, (ISBN 0-930815-39-4).
3. M. E. Vickberg, P. J. Zabinski, B. K. Gilbert, P. J. Zucarelli, and D. V. Weninger, "Design, fabrication, and test of a very compact embeddable global positioning system receiver employing double sided MCM-laminate substrates," to be published in the Proc. Inst. Navigation-Global Positioning System 1994 (ION GPS-94), Salt Palace Convention Center, Salt Lake City, Utah, Sept. 20-23, 1994, in press.
4. G. T. Lei, R. W. Techentin, P. R. Hayes, D. J. Schwab, and B. K. Gilbert, "Wave model solution to the ground/power plane noise problem," IEEE Trans. Instrum. Measurement, to be published.
5. B. K. Gilbert and W. L. Walters, "Design guidelines for digital multichip modules operating at high system clock rates," Int. J. Microcircuits and Electronic Packaging, vol. 15, no. 4, pp. 171-182, (Fourth Quarter) 1992.
6. 2 technology for clock rates up to 1 GHz," in Proc. Int. Electron. Packaging Technical Conf. (IEPS), San Diego, CA, Sept. 1993, vol. 1, pp. 615-627.