Direct wafer bonding technique aiming for freematerial and free-orientation integration of semiconductor materials

IEICE Transactions on Electronics

Volumn E80-C, Issue 5, 1997, Pages 682-687

  Okuno, Yac ^a   Uomi, Kazuhisa ^a   Aokl, Masahiro ^a   Tsuchiya, Tomonobu ^a  

^a HITACHI LTD   (Japan)

Author keywords

Direct wafer bonding; Free material and freeorientation integration; Lattice and orientation mismatches

Indexed keywords

MICROSCOPIC EXAMINATION; SEMICONDUCTING GALLIUM ARSENIDE; SEMICONDUCTING INDIUM PHOSPHIDE; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR LASERS; SEMICONDUCTOR MATERIALS;

DIRECT WAFER BONDING;

INTEGRATED CIRCUITS;

EID: 0031144044     PISSN: 09168524     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (19)

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