Tunable anti-reflective coatings with built-in hard mask properties facilitating thin resist processing

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4343, Issue 1, 2001, Pages 306-316

  Mahorowala, Arpan P ^a   Babich, Katherina ^a   Petrillo, Karen ^a   Simons, John ^a   Angelopoulos, Marie ^a   Patel, Vishnubhai ^a   Grill, Alfred ^a   Halle, Scott ^b   Conti, Richard ^b   Wu, Chung Hsi J ^b   Wise, Richard ^b   Chen, Linda ^c   Thomas, Alan ^b   Lee, Brian ^c   Genz, Oliver ^c  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b IBM RESEARCH   (United States)

^c INFINEON TECHNOLOGIES   (United States)

Author keywords

193 nm resist; 248 nm resist; Anti reflective coating; ARC; BARC; CD control; Contacts; Deep trench; Graded ARC; Hard mask; Oxide etch; PECVD; Reflectivity; Thin resist

Indexed keywords

ELECTRON BEAM LITHOGRAPHY; ETCHING; INTERFACES (MATERIALS); MASKS; PHOTORESISTS; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; REFLECTION;

ELECTRON BEAM RESISTS;

ANTIREFLECTION COATINGS;

EID: 0005451266     PISSN: 0277786X     EISSN: None     Source Type: Journal    
DOI: 10.1117/12.436710     Document Type: Article

References (14)

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