De-embedding procedure based on computed/measured data set for PCB structures characterization

IEEE Transactions on Advanced Packaging

Volumn 27, Issue 4, 2004, Pages 597-602

  Antonini, Giulio ^a   Scogna, Antonio Ciccomancini ^a   Orlandi, Antonio ^a  

^a UNIVERSITY OF L'AQUILA   (Italy)

Author keywords

De embedding; Full wave modeling; S parameters; SMA connectors

Indexed keywords

COMPUTER SIMULATION; ELECTRIC CONNECTORS; MATHEMATICAL MODELS; MATRIX ALGEBRA; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT TESTING; SCATTERING PARAMETERS;

DE-EMBEDDING PROCEDURE; FULL WAVE MODELING; SURFACE MOUNTED ADAPTERS CONNECTORS;

ELECTRONICS PACKAGING;

EID: 9244249839     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2004.831849     Document Type: Article

References (27)

1. K. M. Coperich Branch, J. Morsey, A. C. Cangellaris, and A. E. Ruehli, Physically consistent transmission line models for high-speed interconnects in lossy dielectrics," IEEE Trans. Adv. Packag., vol. 25, pp. 129-135, May 2002.
2. I. M. Elfadel, H. M. Huang, A. E. Ruehli, A. Dounavis, and M. S. Nakhla, "A comparative study of two transient analysis algorithms for lossy transmission lines with frequency dependent data," IEEE Trans. Adv. Packag., vol. 25, pp. 143-153, May 2002.
3. P. Gunupudi, R. Khazaka, and M. S. Nakhla, "Analysis of transmission lines circuit using multidimensional model reduction techniques," IEEE Trans. Adv. Packag., vol. 25, pp. 174-180, May 2002.
4. L. F. Knochaert, F. De Zutter, F. Olyslager, E. Laermans, and J. De Geest, "Recovering lossy multiconductor transmission line parameters from impedance or scattering representation," IEEE Trans. Adv. Packag., vol. 25, pp. 200-205, May 2002.
5. I. S. Stievano, I. A. Maio, and F. G. Canavero, "Parametric macromodels of digital I/O ports," IEEE Trans. Adv. Packag., vol. 25, pp. 255-264, May 2002.
6. E. Laermans, J. De Geest, D. De Zutter, F. Olyslager, S. Sercu, and D. Morlion, "Modeling complex via hole structures," IEEE Trans. Adv. Packag., vol. 25, pp. 206-214, May 2002.
7. G. Antonini, J. L. Drewniak, A. Orlandi, and V. Ricchiuti, "Eye pattern evaluation in high speed digital systems analysis by using MTL modeling," IEEE Trans. Microwave Theory Tech., vol. 50, pp. 1807-1815, July 2002.
8. G. Antonini, A. Ciccomancini Scogna, A. Orlandi, and J. L. Drewniak, "Full-wave modeling of via holes and equivalent circuit extraction for signal integrity analysis," in Proc. EMC EUROPE 2 Int. Symp. Electromagnetic Compatibility, Sorrento, Italy, Sept. 9-13, 2002.
9. C. H. Chen, "A general noise and S-parameter de-embedding procedure for on-wafer high frequency noise measurement of MOSFETs," IEEE Trans. Microwave Theory Tech., vol. 49, pp. 1004-1005, May 2001.
10. P. J. van Wijnem, "A new straightforward calibration and correction procedure for "on wafer" high frequency S-parameter measurements (45 MHz-18 GHz)," in Proc. IEEE Bipolar/BiCMOS Circuits Technology Meeting, Sept. 1987, pp. 70-73.
11. A. Fraser, "GHz on-silicon-wafer probing calibration methods," in Proc. of IEEE Bipolar/BiCMOS Circuits Technology Meeting, Sept. 1988, pp. 154-157.
12. M. C. A. M. Koolen et al., "An improved de-embedding technique for on-wafer high-frequency chracterization," in Proc. IEEE Bipolar/BiCMOS Circuits Technology Meeting, Sept. 1991, pp. 188-191.
13. P. A. Gould and R. G. Davis, "The use of EM simulation in on-wafer microwave device de-embeding," in Proc. IEE Colloq. on Effective Microwave CAD, Dec. 3, 1997.
14. Q. Liang, J. D. Cressler, G. Niu, Y. Lu, G. Freeman, D. C. Ahlgren, R. M, Malladi, K. Newton, and D. L. Harame, "A simple four-port parasitic de-embedding methodology for high-frequency scattering parameter and noise characterization of SiGe HBTs," IEEE Trans. Microwave Theory Tech, vol. 51, pp. 2165-2173, Nov. 2003.
15. H. Cho, "A three-step method for the de-embedding of high-frequency S-parameter measurements," IEEE Trans. Electron Devices, vol. 38, pp. 1371-1375, June 1991.
16. E. P. Vandamme, "Improved three-step de-embedding method to accurately account for the influence of pad parasitics in silicon on-waver RF test-structures," IEEE Trans. Electron Devices, vol. 48, pp. 737-742, Apr. 2001.
17. R. Mahmoudi, "A five-port de-embedding method for floating two port networks," IEEE Trans. Instrum. Meas., vol. 47, pp. 482-488, Apr. 1998.
18. V. Rizzoli, "Computer-aided noise analysis of MESFET and HEMT mixers," IEEE Trans. Microwave Theory Tech., vol. 40, pp. 2013-2024, Nov. 1992.
19. R. A. Pucel, "A general noise de-embedding procedure for packaged two-port linear active devices," IEEE Trans. Microwave Theory Tech. vol. 50, pp. 420-424, Feb. 2002.
20. R. Mavaddat, Network Scattering Parameters, Singapore: World Scientific, 1996.
21. T. Weiland, "A discretization method for the solution of the Maxwell's equations for six components fields," Electron. and Commun. (AEÜ), vol. 31, 1977.
22. Microwave Studio MWS 5.0 - User Manual, Damstadt, Germany, 2004.
23. A. Taflove, Advances in Computational Electrodynamics. Norwood, MA: Artech House, 1998.
24. G. Antonini, A. Ciccomancini Scogna, and A. Orlandi, "Equivalent network synthesis for via holes discontinuities," IEEE Trans. Adv. Packag. vol. 25, pp. 528-536, Nov. 2002.
25. G. Antonini, A. Ciccomancini Scogna, and A. Orlandi, "S-parameters characterization of through, blind and buried via holes," IEEE Transactions Mobile Computing., vol. 2, pp. 174-184, April-June 2003.
26. G. Antonini, A. Ciccomancini Scogna, and A. Orlandi, "Equivalent circuit extraction for an SMA connector," in Proc. PIERS, Pisa, Italy, March 28-30, 2004.
27. G. Antonini, "SPICE compatible equivalent circuits of rational approximation of frequency domain responses," IEEE Trans. Electromagn. Compat., vol. 45, pp. 530-538, Aug. 2003.